Method of manufacturing Cu-TiN composite materials
Dariusz Kołacz, Zbigniew Rdzawski, Joanna Kulasa, Wojciech Głuchowski, Marek Łagoda, Grzegorz Muzia, Krzysztof Wiśniewski, Małgorzata Osadnik
Quarterly No. 2, 2026 pages 133-141
DOI: https://doi.org/10.62753/ctp.2026.07.2.2
keywords: encapsulation, hot isostatic pressing, metallic powder, composite, sinter, hardness, density, electrical conductivity, microstructure
abstract The article analyses sinters produced by encapsulation and sintering under isostatic pressure (HIP). Copper powders, carbonyl iron powders, and Cu-TiN composite powders were employed in the study, using two chemical compositions: Cu = 98% and TiN = 2% and Cu = 96% and TiN = 4% (wt%). Selected parameters of the encapsulation process and the HIP process parameters used are presented. The apparent density, conductivity, and HBW hardness of the sintered samples were measured, and microstructural studies were performed. High-quality sinters were obtained, with porosity of 0.3% for iron and 0.9% for the Cu(TiN)2 composite.